A3PE600-PQG208 vs A3PE3000L-1PQG208 Vergleich
Detaillierter Direktvergleich von A3PE600-PQG208 von Microchip Technology und A3PE3000L-1PQG208 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
A3PE600-PQG208 - 600K Gate ProASIC3E FPGA 208-PQFP | Microchip
A3PE600-PQG208 ✓ AktivMicrochip Technology
A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
A3PE3000L-1PQG208 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-PQG208 | A3PE3000L-1PQG208 |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,64 | $162,90 |
| Family | ProASIC3E (Flash FPGA) | ProASIC3L (ProASIC3E family, low power) |
| System Gates | 600,000 | 3000000 |
| User I/O | 147 | — |
| Total Embedded RAM | 110,592 bits | — |
| Core Supply Voltage | 1.425 V to 1.575 V | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm | 130 nm flash |
| Configuration Technology | Flash (nonvolatile, single-chip) | — |
| Gehäuse | 208-Pin PQFP (BFQFP), surface mount | 208-BFQFP (PQFP-208) |
| Betriebstemperatur | 0C to +70C (commercial) | — |
| Montageart | Surface Mount | — |
| Programmability | In-system reprogrammable | — |
| Power-Up Behavior | Live at power-up (no external configuration device) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead Free Status | Lead Free | — |
| Target Markets | Consumer, networking/communications, computing, avionics | — |
| Manufacturer Part Number | — | A3PE3000L-1PQG208 |
| Logic Elements | — | 35K LEs |
| Number of I/O | — | 147 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Betriebsversorgungsspannung | — | 1.5 V |
| Maximum Operating Frequency | — | 892.86 MHz |
| Configuration Memory | — | Flash (single-chip, reprogrammable) |
| Low Power Feature | — | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Montagestil | — | SMD/SMT |
| Betriebstemperaturbereich | — | 0C to +70C |
| Packaging | — | Tray |
| Lead Free | — | Yes (G suffix) |