A3PE600-PQG208IX218 vs A3PE3000L-1PQG208 Vergleich
Detaillierter Direktvergleich von A3PE600-PQG208IX218 von Microsemi und A3PE3000L-1PQG208 von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microsemi
A3PE600-PQG208IX218 - ProASIC3E Flash FPGA 600K Gates | Microsemi
A3PE600-PQG208IX218 ✓ AktivMicrochip Technology
A3PE3000L-1PQG208 - ProASIC3L FPGA 147 I/O | Microchip
A3PE3000L-1PQG208 ✓ AktivSpezifikationsvergleich
| Parameter | A3PE600-PQG208IX218 | A3PE3000L-1PQG208 |
|---|---|---|
| Marke | Microsemi | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $47,80 | $162,90 |
| Family | ProASIC3E Flash FPGA | ProASIC3L (ProASIC3E family, low power) |
| Number of Gates | 600K | — |
| Maximum System Frequency | 231 MHz | — |
| Process Technology | 130 nm Flash | 130 nm flash |
| Core Supply Voltage | 1.5 V | — |
| Gehäuse | 208-Pin PQFP (PQG208) | 208-BFQFP (PQFP-208) |
| Number of User I/O | 147 | — |
| Configuration Memory | On-chip Flash (non-volatile) | Flash (single-chip, reprogrammable) |
| Montageart | Surface Mount | — |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| Number of Logic Elements (DFFs) | [DATA_NEEDED: DFF count] | — |
| Embedded Memory | [DATA_NEEDED: embedded SRAM bits] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Lead Free Status | Lead Free | — |
| RoHS-Status | RoHS Compliant | [DATA_NEEDED: RoHS compliance status] |
| Soft CPU Support | Optional Soft ARM Support | — |
| Manufacturer Part Number | — | A3PE3000L-1PQG208 |
| System Gates | — | 3000000 |
| Logic Elements | — | 35K LEs |
| Number of I/O | — | 147 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Betriebsversorgungsspannung | — | 1.5 V |
| Maximum Operating Frequency | — | 892.86 MHz |
| Low Power Feature | — | Flash*Freeze technology (40% dynamic / 50% static power reduction) |
| Montagestil | — | SMD/SMT |
| Betriebstemperaturbereich | — | 0C to +70C |
| Packaging | — | Tray |
| Lead Free | — | Yes (G suffix) |