AD7686BCPZ-R2 vs AD7687BCPZ Vergleich
Detaillierter Direktvergleich von AD7686BCPZ-R2 von Analog Devices und AD7687BCPZ von Analog Devices. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | AD7686BCPZ-R2 | AD7687BCPZ |
|---|---|---|
| Marke | Analog Devices | Analog Devices |
| Kategorie | ADC/DAC | ADC/DAC |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $6,80 | $9,67 |
| Auflösung | 16 bit | 16 bit |
| Number of Sample Points | [DATA_NEEDED: number_of_inputs] | — |
| Abtastrate | 500 kSPS | 250 kSPS |
| Architecture | SAR (Successive Approximation) | SAR |
| Input Type | Single-Ended, Pseudo-Differential | Differential |
| Number of Channels | 1 | — |
| Supply Voltage VDD | 4.5 V to 5.5 V | — |
| Logic Interface Voltage VIO | 2.3 V to 5.5 V | — |
| Referenzspannung | 2.5 V internal (typical) or external | — |
| Power Consumption | [DATA_NEEDED: power_consumption_active_value] | 4.5 mW at 250 kSPS |
| Power Consumption (Full Power Down) | [DATA_NEEDED: power_down_value] | — |
| Betriebstemperaturbereich | -40 °C to +85 °C | -40°C to +85°C |
| Gehäuse | 10-LFCSP-WD (3x3 mm) with exposed pad | 10-LFCSP-WD (3x3 mm) |
| Montageart | Surface Mount | Surface Mount |
| Schnittstelle | SPI, QSPI, MICROWIRE, DSP-compatible serial | SPI |
| INL (Max) | [DATA_NEEDED: inl_max] | — |
| SNR (typical) | [DATA_NEEDED: snr_typical] | — |
| ESD Rating (HBM) | [DATA_NEEDED: esd_hbm] | — |
| RoHS-Status | Compliant | Compliant |
| MSL-Level | [DATA_NEEDED: msl_level] | — |
| Number of Input Channels | — | 1 |
| Versorgungsspannung | — | 2.3 V to 5.5 V |
| Logic Supply Voltage (VIO) | — | 1.8 V to 5.5 V |
| INL (Integrale Nichtlinearität) | — | ±1.5 LSB |
| SNR (Signal-to-Noise Ratio) | — | 92 dB |
| THD (Total Harmonic Distortion) | — | -108 dB |