AD7687BCPZ vs AD7686BCPZ-R2 Vergleich
Detaillierter Direktvergleich von AD7687BCPZ von Analog Devices und AD7686BCPZ-R2 von Analog Devices. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | AD7687BCPZ | AD7686BCPZ-R2 |
|---|---|---|
| Marke | Analog Devices | Analog Devices |
| Kategorie | ADC/DAC | ADC/DAC |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,67 | $6,80 |
| Auflösung | 16 bit | 16 bit |
| Abtastrate | 250 kSPS | 500 kSPS |
| Number of Input Channels | 1 | — |
| Input Type | Differential | Single-Ended, Pseudo-Differential |
| Schnittstelle | SPI | SPI, QSPI, MICROWIRE, DSP-compatible serial |
| Architecture | SAR | SAR (Successive Approximation) |
| Versorgungsspannung | 2.3 V to 5.5 V | — |
| Logic Supply Voltage (VIO) | 1.8 V to 5.5 V | — |
| INL (Integrale Nichtlinearität) | ±1.5 LSB | — |
| SNR (Signal-to-Noise Ratio) | 92 dB | — |
| THD (Total Harmonic Distortion) | -108 dB | — |
| Power Consumption | 4.5 mW at 250 kSPS | [DATA_NEEDED: power_consumption_active_value] |
| Betriebstemperaturbereich | -40°C to +85°C | -40 °C to +85 °C |
| Gehäuse | 10-LFCSP-WD (3x3 mm) | 10-LFCSP-WD (3x3 mm) with exposed pad |
| Montageart | Surface Mount | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Number of Sample Points | — | [DATA_NEEDED: number_of_inputs] |
| Number of Channels | — | 1 |
| Supply Voltage VDD | — | 4.5 V to 5.5 V |
| Logic Interface Voltage VIO | — | 2.3 V to 5.5 V |
| Referenzspannung | — | 2.5 V internal (typical) or external |
| Power Consumption (Full Power Down) | — | [DATA_NEEDED: power_down_value] |
| INL (Max) | — | [DATA_NEEDED: inl_max] |
| SNR (typical) | — | [DATA_NEEDED: snr_typical] |
| ESD Rating (HBM) | — | [DATA_NEEDED: esd_hbm] |
| MSL-Level | — | [DATA_NEEDED: msl_level] |