ADS41B29IRGZ25 vs ADS6129IRGZ25 Vergleich

Detaillierter Direktvergleich von ADS41B29IRGZ25 von Texas Instruments und ADS6129IRGZ25 von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Texas Instruments
ADS41B29IRGZ25 ADS41B29IRGZ25 - 12-Bit 250MSPS Buffered Low-Power ADC | TI

ADS41B29IRGZ25 - 12-Bit 250MSPS Buffered Low-Power ADC | TI

ADS41B29IRGZ25 ✓ Aktiv
Texas Instruments
ADS6129IRGZ25 ADS6129IRGZ25 - 12-Bit 250MSPS Low-Power ADC | Texas Instruments

ADS6129IRGZ25 - 12-Bit 250MSPS Low-Power ADC | Texas Instruments

ADS6129IRGZ25 ✓ Aktiv

Spezifikationsvergleich

Parameter ADS41B29IRGZ25 ADS6129IRGZ25
Marke Texas Instruments Texas Instruments
Kategorie ADC/DAC ADC/DAC
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $19,95 $23,10
Auflösung 12 bits 12 bit
Number of Input Channels 1 1
Conversion Architecture Pipelined —
Maximum Sample Rate 250 MSPS —
Analog Input Buffered differential —
Digital Output Interface Parallel CMOS / DDR LVDS —
Input Voltage Range (Full-Scale) 2.0 Vpp differential —
Analog Supply Voltage 3.3 V 1.8 V to 3.3 V
Digital Supply Voltage 1.8 V 1.8 V to 3.3 V
Power Consumption [DATA_NEEDED: power consumption mW] —
SNR at 100 MHz Input [DATA_NEEDED: SNR dBFS] —
SFDR at 100 MHz Input [DATA_NEEDED: SFDR dBc] —
Betriebstemperaturbereich -40C to +85C -40 °C to +85 °C
Package Type 48-VQFN (7x7 mm) with exposed pad —
Package Code HVQCCN —
Montageart Surface Mount Surface Mount
MSL-Level 3 —
Lead-Free / RoHS Yes / Compliant —
Input Buffer Integrated (no external driver required) —
Programming Interface 3-wire / 4-wire serial —
Sample Rate — 250 MSPS
Architecture — Pipelined
Input Type — Differential
Data Output Interface — LVDS DDR / Parallel CMOS
Power Dissipation (CMOS, 250 MSPS) — 430 mW
SNR — 70 dBFS (typ at 100 MHz input)
SFDR — 85 dBc (typ)
Analog Input Bandwidth — 1.5 GHz (typ)
Full-Scale Input — 2 Vpp differential
Gehäuse — 48-VQFN (7x7 mm) with thermal pad
RoHS-Status — Compliant

Datenblätter & Ressourcen

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