AFS600-1FGG256 vs M7AFS600-1FGG256I Vergleich
Detaillierter Direktvergleich von AFS600-1FGG256 von Microchip Technology und M7AFS600-1FGG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ AktivMicrochip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-1FGG256 | M7AFS600-1FGG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | — |
| Versorgungsspannung | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm, 7-layer metal flash-based CMOS |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| Betriebstemperatur | 0°C to 70°C | — |
| Configuration Memory | Embedded nonvolatile flash | Flash (nonvolatile) |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| RoHS-Status | RoHS compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Family | — | Fusion (Mixed-Signal Flash FPGA) |
| Processor Core | — | ARM CoreMP7 |
| Number of I/O | — | 119 |
| Betriebsversorgungsspannung | — | 1.5 V |
| System Performance | — | Up to 350 MHz |
| Speed Grade | — | -1 |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Gehäuse / Bauform | — | 256-Ball FBGA (FGG256) |
| Montagestil | — | SMD/SMT |
| Packaging | — | Tray |
| Series | — | M7AFS600 |
| Live at Power-Up (LAPU) | — | Yes |
| Analog Subsystem | — | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) |