AFS600-1FGG256 vs M7AFS600-FG256I Vergleich
Detaillierter Direktvergleich von AFS600-1FGG256 von Microchip Technology und M7AFS600-FG256I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ AktivMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-1FGG256 | M7AFS600-FG256I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 gates | 600K |
| User I/O | 119 I/O | — |
| Versorgungsspannung | 1.5 V | — |
| Logic Family | Flash-based CMOS | — |
| Process Technology | 130 nm CMOS | 130 nm |
| Metal Layers | 7 layers | — |
| Package Type | 256-ball FBGA | — |
| Package Pin Count | 256 balls | — |
| Package Pitch | 1.0 mm | — |
| Betriebstemperatur | 0°C to 70°C | — |
| Configuration Memory | Embedded nonvolatile flash | — |
| Power-Up Configuration | Live at power-up | — |
| Integrated Analog Resources | Configurable analog blocks | — |
| Integrated Clock Management | Clock generation and management | — |
| Embedded Memory | Large flash memory blocks | — |
| Package Family | FBGA surface-mount package family | — |
| RoHS-Status | RoHS compliant | — |
| Lead-Free Status | Lead-free | — |
| Pin Assignments | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] | — |
| Maximum Operating Frequency | [DATA_NEEDED: maximum operating frequency] | — |
| Series | — | M7AFS600 (Fusion) |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Embedded Processor | — | ARM CoreMP7 |
| Core Supply Voltage | — | 1.5 V |
| Gehäuse / Bauform | — | 256-LBGA (FBGA) |
| Terminal Form | — | Ball |
| Package Shape | — | Square |
| Montagestil | — | SMD/SMT |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packaging | — | Tray |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |