AFS600-2FG484I vs M7AFS600-2FG484I Vergleich
Detaillierter Direktvergleich von AFS600-2FG484I von Microchip Technology und M7AFS600-2FG484I von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-2FG484I - 600K Gate Mixed-Signal FPGA | Microchip
AFS600-2FG484I UnknownMicrochip Technology
M7AFS600-2FG484I - 600K Gate Flash FPGA, 172 I/O | Microchip
M7AFS600-2FG484I ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-2FG484I | M7AFS600-2FG484I |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Unknown | Aktiv |
| Device Type | Fusion mixed-signal FPGA | — |
| System Gates | 600,000 gates | 600000 gates |
| Programmable Logic Architecture | Flash-based CMOS programmable logic | — |
| Configuration Retention | Nonvolatile when power is off | — |
| Power-Up Configuration | Live at power-up supported | — |
| Integrated Analog Capability | Configurable analog resources | — |
| Embedded Memory | Large flash memory blocks | — |
| Clock Support | Clock generation and management circuitry | — |
| Gehäuse | 484-BGA | 484-ball FBGA, 1.0 mm pitch |
| Package Mounting Type | Surface mount | — |
| Speed Grade | -2 | -2 |
| Temperature Grade | Industrial grade | Industrial (I suffix) |
| Logic Family | CMOS | CMOS |
| Anzahl der Pins | 484 pins | — |
| Core Supply Voltage | [DATA_NEEDED: target AFS600-2FG484I supply voltage] | 1.5 V |
| Betriebstemperaturbereich | [DATA_NEEDED: target AFS600-2FG484I operating temperature range] | — |
| I/O Count | [DATA_NEEDED: target AFS600-2FG484I I/O count] | — |
| Analog ADC Count | [DATA_NEEDED: target AFS600-2FG484I ADC count] | — |
| RoHS-Status | RoHS compliant | — |
| Lead-Free Status | Lead free | — |
| Family | — | Fusion (Flash-Based FPGA) |
| Logic Elements (D Flip-Flops) | — | 110592 |
| User I/O | — | 172 |
| Process Technology | — | 130 nm, 7-layer metal flash-based CMOS |
| Configuration Memory | — | Nonvolatile on-chip flash (retains program when powered off) |
| Live at Power-Up (LAPU) | — | Yes |
| Optional Processor Support | — | ARM CoreMP7 |
| Betriebstemperatur | — | 0 to 70 C |
| Montageart | — | Surface Mount |
| Packaging | — | Tray |