AFS600-FG256K vs AFS600-FGG256K Vergleich
Detaillierter Direktvergleich von AFS600-FG256K von Microchip Technology und AFS600-FGG256K von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
AFS600-FGG256K - 600K-Gate Fusion FPGA | Microchip Technology
AFS600-FGG256K ✓ AktivSpezifikationsvergleich
| Parameter | AFS600-FG256K | AFS600-FGG256K |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| System Gates | 600,000 system gates | 600,000 gates |
| Logic Cells | 13,824 logic cells | — |
| Device Type | Fusion mixed-signal FPGA | Fusion mixed-signal field-programmable gate array (FPGA) |
| Programmable Logic | Flash-based CMOS programmable logic | — |
| Configuration Technology | Nonvolatile flash configuration | — |
| Power-Off Retention | Program retained when powered off | — |
| Power-Up Behavior | Live at Power-Up (LAPU) | — |
| Process Technology | 130 nm CMOS | 130 nm flash-based CMOS |
| Metal Layers | 7 metal layers | 7 layers |
| Logic Family | CMOS | CMOS |
| Versorgungsspannung | 1.5 V | 1.5 V |
| Betriebstemperaturbereich | 0°C to 70°C | — |
| Package Type | BGA-256, 1.0 mm pitch | 256-pin FBGA |
| Pin-Anzahl | 256 pins | — |
| Montageart | Surface mount | Surface mount |
| ARM Support | Optional ARM support in the Fusion family | — |
| User I/O | — | 119 I/O |
| Embedded Flash Memory | — | 110,592 bits |
| Package Ball Pitch | — | 1.0 mm |
| Total Pins | — | 256 pins |
| Betriebstemperatur | — | 0°C to +70°C |
| Configuration Memory Type | — | Embedded nonvolatile flash |
| Power-Off Data Retention | — | Yes |
| Live at Power-Up | — | Yes |
| Listed Maximum Frequency | — | 1098.9 MHz |
| RoHS-Status | — | unknown |
| REACH Status | — | unknown |