ATSAM4SD32CB-CN vs ATSAM4SD32CB-CFN Vergleich

Detaillierter Direktvergleich von ATSAM4SD32CB-CN von Microchip Technology und ATSAM4SD32CB-CFN von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAM4SD32CB-CN ATSAM4SD32CB-CN - SAM4S ARM Cortex-M4 MCU 120MHz 2MB Flash | Microchip

ATSAM4SD32CB-CN - SAM4S ARM Cortex-M4 MCU 120MHz 2MB Flash | Microchip

ATSAM4SD32CB-CN ✓ Aktiv
Microchip Technology
ATSAM4SD32CB-CFN ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN - 120MHz Cortex-M4 MCU 2MB Flash | Microchip

ATSAM4SD32CB-CFN ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAM4SD32CB-CN ATSAM4SD32CB-CFN
Marke Microchip Technology Microchip Technology
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $14,75 $6,05
Core Architecture ARM Cortex-M4 (32-bit) ARM Cortex-M4 with FPU and MPU
Core Revision Revision B (silicon errata fixed) —
Maximum Core Clock 120 MHz —
Flash Memory 2 MB (2048 KB), dual-bank with cache 2 MB (2048 KB)
SRAM 160 KB 160 KB
Gehäuse 100-TFBGA, 9 mm x 9 mm 100-ball VFBGA, 7x7 mm, 0.65 mm pitch
Supply Voltage (VDDIO) 1.62 V to 3.6 V —
Betriebstemperatur -40C to +85C (industrial) —
USB Full-speed USB Device with embedded transceiver —
ADC Dual 12-bit, up to 16 channels (family feature) 12-bit, up to 16 channels
DAC 12-bit, 1 channel —
External Memory Bus 16-bit static memory controller (NAND/NOR/SDRAM) —
FPU Single-precision IEEE 754 —
DSP Extensions Yes (MAC, SIMD) —
DMA Peripheral DMA controller —
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Compliant (Pb-free TFBGA) Compliant (Pb-free)
Maximum CPU Clock — 120 MHz
Cache — Up to 4 KB (Flash controller cache)
Core Mark / DMIPS — 1.25 DMIPS/MHz (150 DMIPS at 120 MHz)
Operating Voltage (VDDIO/VDDIN) — 1.62 V to 3.6 V
Core Voltage (internal) — 1.2 V (internal LDO)
USB Interface — Full-speed USB Device with on-chip transceiver
Communication Interfaces — 5x USART, 3x SPI, 2x TWI (I2C), 1x HS USB, 1x CAN, 1x SSC, 1x EMAC
DMA Channels — 16 peripheral DMA channels
Timers — Two 16-bit TC channels, one 16-bit PWM, one RTC, one RTT
Operating Temperature (Grade) — -40C to +85C (industrial)
MSL-Level — 3 (per JEDEC J-STD-020, reflow at 260C)
Lead-free / Halogen-free — Lead-free (green) per Microchip data

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