ATSAMA5D22B-CUR vs ATSAMA5D21B-CU Vergleich

Detaillierter Direktvergleich von ATSAMA5D22B-CUR von Microchip Technology und ATSAMA5D21B-CU von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAMA5D22B-CUR ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D22B-CUR ✓ Aktiv
Microchip Technology
ATSAMA5D21B-CU ATSAMA5D21B-CU - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D21B-CU - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D21B-CU ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAMA5D22B-CUR ATSAMA5D21B-CU
Marke Microchip Technology Microchip Technology
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,10 $9,80
Core Architecture ARM Cortex-A5 (32-bit, single-core) —
Maximum CPU Clock 500 MHz 500 MHz
L1 Instruction Cache 128 Kbyte —
L1 Data Cache 128 Kbyte —
L2 Cache 32 Kbyte —
NEON Media Engine Yes (NEON MPE) —
Floating Point Unit VFPv4-D32 (single and double precision) —
External Memory Controller 16-bit DDR2/LPDDR/LPDDR2/DDR3(L) —
Display Controller 24-bit LCD with overlays, 2D graphics accelerator —
Video Decoder H.264 / MPEG-4 / VP8 / JPEG hardware decode —
Ethernet 10/100/1000 Mbps with IEEE 1588 —
USB USB 2.0 High-Speed Host and Device —
CAN 2x CAN-FD —
Crypto Accelerator AES, SHA, TRNG; ARM TrustZone secure boot —
Versorgungsspannung 0.9 V core / 1.8 V / 3.3 V I/O (typical) —
Operating Temperature (Industrial) -40C to +85C —
Gehäuse 196-TFBGA, 11x11 mm, 0.75 mm pitch 196-TFBGA (11x11 mm)
Montageart Surface Mount Surface Mount
MSL-Level 3 (per JEDEC J-STD-020) 3
RoHS-Status Compliant Compliant
Deep-Sleep Current <5 uA with backup self-refresh —
Manufacturer — Microchip Technology
Series — SAMA5D2
Core Processor — ARM Cortex-A5
Core Count — 1
Datenbusbreite — 32-bit
Ball Pitch — 0.8 mm
Betriebstemperatur — -40C to +85C
External Memory Support — DDR2/DDR3L/LPDDR2/LPDDR3, QSPI, e.MMC
Co-processors — NEON MPE, FPU
Backup Mode Current — 5 uA (typical)
Security Features — AES, SHA, TRNG, Secure Boot, Tamper Detection

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