ATSAMA5D22B-CUR vs ATSAMA5D22C-CU Vergleich

Detaillierter Direktvergleich von ATSAMA5D22B-CUR von Microchip Technology und ATSAMA5D22C-CU von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAMA5D22B-CUR ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip

ATSAMA5D22B-CUR ✓ Aktiv
Microchip Technology
ATSAMA5D22C-CU ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip

ATSAMA5D22C-CU - 500MHz Cortex-A5 MPU, 196-TFBGA | Microchip

ATSAMA5D22C-CU ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAMA5D22B-CUR ATSAMA5D22C-CU
Marke Microchip Technology Microchip Technology
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,10 $7,14
Core Architecture ARM Cortex-A5 (32-bit, single-core) ARM Cortex-A5 (32-bit)
Maximum CPU Clock 500 MHz 500 MHz
L1 Instruction Cache 128 Kbyte 32 KB
L1 Data Cache 128 Kbyte 32 KB
L2 Cache 32 Kbyte 128 KB
NEON Media Engine Yes (NEON MPE) Yes
Floating Point Unit VFPv4-D32 (single and double precision) —
External Memory Controller 16-bit DDR2/LPDDR/LPDDR2/DDR3(L) —
Display Controller 24-bit LCD with overlays, 2D graphics accelerator —
Video Decoder H.264 / MPEG-4 / VP8 / JPEG hardware decode —
Ethernet 10/100/1000 Mbps with IEEE 1588 Dual 10/100 Mbps EMAC with 1588 PTP
USB USB 2.0 High-Speed Host and Device USB HSIC + USB Host/Device
CAN 2x CAN-FD Dual CAN-FD
Crypto Accelerator AES, SHA, TRNG; ARM TrustZone secure boot —
Versorgungsspannung 0.9 V core / 1.8 V / 3.3 V I/O (typical) —
Operating Temperature (Industrial) -40C to +85C —
Gehäuse 196-TFBGA, 11x11 mm, 0.75 mm pitch 196-TFBGA (CSBGA) 11x11 mm
Montageart Surface Mount Surface Mount (BGA)
MSL-Level 3 (per JEDEC J-STD-020) —
RoHS-Status Compliant Compliant
Deep-Sleep Current <5 uA with backup self-refresh —
Core Count — 1
External Memory Support — DDR2, DDR3L, LPDDR2, LPDDR3, QSPI, e.MMC
2D Graphics Engine — Yes (up to WXGA 1366x768)
LCD Interface — 24-bit, up to 1366x768
Ball Pitch — 0.8 mm
Betriebstemperatur — -40C to +85C (industrial)
Cryptographic Accelerator — AES, SHA, TRNG (hardware)
Peripheral Touch Controller — PTC (embedded)
Audio Subsystem — Embedded (I2S, SSC)

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