ATSAMA5D23B-CN vs ATSAMA5D22B-CUR Vergleich
Detaillierter Direktvergleich von ATSAMA5D23B-CN von Microchip Technology und ATSAMA5D22B-CUR von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Microchip Technology
ATSAMA5D23B-CN - 500MHz ARM Cortex-A5 MPU 128KB SRAM | Microchip
ATSAMA5D23B-CN ✓ AktivMicrochip Technology
ATSAMA5D22B-CUR - ARM Cortex-A5 500MHz MPU, 196-TFBGA | Microchip
ATSAMA5D22B-CUR ✓ AktivSpezifikationsvergleich
| Parameter | ATSAMA5D23B-CN | ATSAMA5D22B-CUR |
|---|---|---|
| Marke | Microchip Technology | Microchip Technology |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $9,55 | $9,10 |
| Core Architecture | ARM Cortex-A5 (Armv7-A) | ARM Cortex-A5 (32-bit, single-core) |
| Number of Cores | 1 | — |
| Maximum Clock Speed | 500 MHz | — |
| L1 Instruction Cache | 32 kbyte | 128 Kbyte |
| L1 Data Cache | 32 kbyte | 128 Kbyte |
| L2 Cache | 128 kbyte (configurable as internal SRAM) | 32 Kbyte |
| NEON Media Engine | Yes | Yes (NEON MPE) |
| ARM TrustZone | Yes | — |
| MMU | Yes | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Gehäuse | 196-TFBGA (11x11 mm) | 196-TFBGA, 11x11 mm, 0.75 mm pitch |
| Ball Pitch | 0.8 mm | — |
| Montageart | Surface Mount | Surface Mount |
| Backup Mode Current | 5 uA typical | — |
| Datenbusbreite | 32-bit | — |
| Series | SAMA5D2 | — |
| RoHS-Status | Compliant | Compliant |
| Maximum CPU Clock | — | 500 MHz |
| Floating Point Unit | — | VFPv4-D32 (single and double precision) |
| External Memory Controller | — | 16-bit DDR2/LPDDR/LPDDR2/DDR3(L) |
| Display Controller | — | 24-bit LCD with overlays, 2D graphics accelerator |
| Video Decoder | — | H.264 / MPEG-4 / VP8 / JPEG hardware decode |
| Ethernet | — | 10/100/1000 Mbps with IEEE 1588 |
| USB | — | USB 2.0 High-Speed Host and Device |
| CAN | — | 2x CAN-FD |
| Crypto Accelerator | — | AES, SHA, TRNG; ARM TrustZone secure boot |
| Versorgungsspannung | — | 0.9 V core / 1.8 V / 3.3 V I/O (typical) |
| Operating Temperature (Industrial) | — | -40C to +85C |
| MSL-Level | — | 3 (per JEDEC J-STD-020) |
| Deep-Sleep Current | — | <5 uA with backup self-refresh |