ATSAMA5D27C-D1G-CUR vs ATSAMA5D27C-CUR Vergleich

Detaillierter Direktvergleich von ATSAMA5D27C-D1G-CUR von Microchip Technology und ATSAMA5D27C-CUR von Microchip Technology. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Microchip Technology
ATSAMA5D27C-D1G-CUR ATSAMA5D27C-D1G-CUR - 500MHz Cortex-A5 MPU 1Gbit DDR2 SiP | Microchip

ATSAMA5D27C-D1G-CUR - 500MHz Cortex-A5 MPU 1Gbit DDR2 SiP | Microchip

ATSAMA5D27C-D1G-CUR ✓ Aktiv
Microchip Technology
ATSAMA5D27C-CUR ATSAMA5D27C-CUR - ARM Cortex-A5 MPU 500MHz | 289-LFBGA

ATSAMA5D27C-CUR - ARM Cortex-A5 MPU 500MHz | 289-LFBGA

ATSAMA5D27C-CUR ✓ Aktiv

Spezifikationsvergleich

Parameter ATSAMA5D27C-D1G-CUR ATSAMA5D27C-CUR
Marke Microchip Technology Microchip Technology
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $12,05 $12,90
Core Architecture ARM Cortex-A5 (32-bit, single-core) ARM Cortex-A5 (32-bit) with NEON and FPU
Maximum CPU Clock 500 MHz 500 MHz
L1 Instruction Cache 32 KB —
L1 Data Cache 32 KB —
Integrated DRAM 1 Gbit DDR2 SDRAM (SiP) —
External Memory Controller 16-bit DDR2/DDR3L/LPDDR2/LPDDR3, plus QSPI and e.MMC —
Gehäuse 289-TFBGA (14x14 mm, 0.8 mm pitch) 289-LFBGA (14 x 14 mm, 0.8 mm pitch)
Supply Voltage (Core) 1.2 V (typical) —
Betriebstemperatur -40 C to +85 C (industrial) —
Ethernet 1x RGMII + 1x RMII (Gigabit-capable EMAC) 10/100 MAC with IEEE 1588 (EMAC)
USB 2x HS USB (one Host, one Device) USB 2.0 HS Host + HS OTG + HS Device (3 ports)
CAN 2x CAN-FD controllers 2x CAN-FD controllers
Flexible Serial (FLEXCOM) 3x (USART/SPI/TWI configurable) —
Image Sensor Interface (ISI) Up to 24-bit parallel camera input —
Touch Controller Peripheral Touch Controller (PTC) Peripheral Touch Controller (PTC)
Audio Subsystem Embedded SSC + sample-rate converters Embedded (Class-D, I2S, SPDIF)
Cryptography AES, SHA, TRNG, secure boot, monotonic counters AES, SHA, TRNG, secure boot
Montageart Surface Mount (BGA) Surface Mount (Tape & Reel)
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status Compliant Compliant
Core Count — 1
Cache (I-cache / D-cache) — 32 KB / 32 KB
Internal SRAM — 128 KB
ROM — 160 KB
External Memory Bus — 16-bit DDR2 / LPDDR / DDR3 / LPDDR3
Operating Voltage (Core) — 1.2 V
Betriebstemperaturbereich — -40 °C to +85 °C (industrial)
Display Controller — TFT LCD up to 1024 x 768
Backup Mode Current — 5 µA typical (DDR in Self-Refresh)

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