BC660K-GL-TE-B vs BC66F3663 Vergleich

Detaillierter Direktvergleich von BC660K-GL-TE-B von Quectel und BC66F3663 von Holtek Semiconductor. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Quectel
BC660K-GL-TE-B Quectel BC660K-GL-TE-B LTE Cat NB2 Module | Quectel

Quectel BC660K-GL-TE-B LTE Cat NB2 Module | Quectel

BC660K-GL-TE-B ✓ Aktiv
Holtek Semiconductor
BC66F3663 BC66F3663 - Sub-1GHz OOK/GFSK Transceiver Flash MCU | Holtek

BC66F3663 - Sub-1GHz OOK/GFSK Transceiver Flash MCU | Holtek

BC66F3663 ✗ Abgekündigt

Spezifikationsvergleich

Parameter BC660K-GL-TE-B BC66F3663
Marke Quectel Holtek Semiconductor
Kategorie RF Modules RF Transceivers
Lebenszyklusstatus Aktiv Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $0,00
Product Type LTE Cat NB2 (NB-IoT) module Sub-1GHz OOK/GFSK Transceiver Flash MCU
Standard 3GPP LTE Cat NB2 —
Maximum Downlink Rate 127 Kbps —
Maximum Uplink Rate 158.5 Kbps —
Supported Bands B1/2/3/4/5/8/12/13/17/18/19/20/25/28/66/70/85 —
Gehäuse LCC, SMT 46-pin QFN-A
Dimensions 17.7 mm x 15.8 mm x 2.0 mm —
Weight 1.8 g —
Betriebstemperatur -40C to +85C [DATA_NEEDED: operating temperature range]
Technology Class LPWA (low-power wide-area) —
Power Consumption [DATA_NEEDED: power consumption figures] —
Versorgungsspannung [DATA_NEEDED: supply voltage range] [DATA_NEEDED: operating voltage range]
GNSS Support [DATA_NEEDED: GNSS variant availability] —
AT Command Control Yes (BC660K-GL/BC950K-GL AT Commands Manual V1.3) —
Compatible Family BC66 / BC66-NA (Quectel compatible design manual) —
RoHS-Status [DATA_NEEDED: RoHS status] —
Modulation — OOK, GFSK
Frequency Band — [DATA_NEEDED: operating frequency range]
RF Data Rate — [DATA_NEEDED: maximum air data rate]
TX Output Power — [DATA_NEEDED: maximum TX power]
RX Sensitivity — [DATA_NEEDED: RX sensitivity]
Flash Memory — [DATA_NEEDED: program flash size]
SRAM — [DATA_NEEDED: SRAM size]
EEPROM — [DATA_NEEDED: data EEPROM size]
Core Architecture — [DATA_NEEDED: MCU core architecture]
Debug Interface — OCDS (via BC66V3663 EV chip, OCDSDA/OCDSCK pins)
Datasheet Revision — V1.00 (November 01, 2023)
Lebenszyklusstatus — EOL - last purchase date October 25, 2025

Datenblätter & Ressourcen

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