DCM28AP120T320A50 vs DCM3623T50M13C2M00 Vergleich
Detaillierter Direktvergleich von DCM28AP120T320A50 von Vicor und DCM3623T50M13C2M00 von Vicor. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DCM28AP120T320A50 | DCM3623T50M13C2M00 |
|---|---|---|
| Marke | Vicor | Vicor |
| Kategorie | DC-DC Converters | DC-DC Converters |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $318,75 | $386,83 |
| Topologie | Isolated DC-DC Converter (DCM Sine Amplitude Converter) | — |
| Manufacturer | Vicor Corporation | Vicor Corporation |
| Product Family | VI Chip® DCM® (Direct Conversion Module) | — |
| Base Part Number | MDCM28AP120M320A50 / DCM3623T50M13C2C00 | — |
| Eingangsspannungsbereich | 16 V to 50 V (28 V nominal) | 16 V to 50 V |
| Ausgangsspannung | 12 V (nominal, regulated) | 12 V |
| Output Current | 26.67 A continuous | — |
| Output Power | 320 W | 320 W |
| Isolation Voltage | 2250 VDC (input to output) | [DATA_NEEDED: input-to-output isolation rating] |
| Betriebstemperatur | -20 °C to +125 °C (case, A50 grade) | — |
| Montageart | Through Hole (Chassis-mount or PCB-thru package) | Through-Hole (ChiP) |
| Cooling | Top-side cold plate (T-suffix form factor) | — |
| Gehäuse | VI Chip® DCM chassis-mount through-hole | — |
| Reflow Solder Compatibility | Not intended for reflow solder attach (per datasheet note) | — |
| Standards / Compliance | UL 60950-1, EN 60950-1, CE marked, RoHS | — |
| Series | — | DCM® 3623 |
| Type | — | Isolated Module DC-DC Converter |
| Anzahl der Ausgänge | — | 1 |
| Ausgangsstrom (max.) | — | 26.67 A |
| Input Voltage (Nominal) | — | 28 V |
| Wirkungsgrad | — | [DATA_NEEDED: typical efficiency curve value] |
| Temperature Grade | — | M = -55°C to +125°C (Military) |
| Betriebstemperaturbereich | — | -55 °C to +125 °C |
| Control Interface | — | Analog (C2) |
| Gehäuse / Bauform | — | 3623 ChiP Through-Hole Module |
| Packaging | — | Tray |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |