DP83822HRHB vs DP83822HRHBT Vergleich
Detaillierter Direktvergleich von DP83822HRHB von Texas Instruments und DP83822HRHBT von Texas Instruments. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DP83822HRHB | DP83822HRHBT |
|---|---|---|
| Marke | Texas Instruments | Texas Instruments |
| Kategorie | RF Transceivers | Interface ICs |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Product Type | Ethernet PHY Transceiver | 10/100-Mbps Ethernet physical-layer transceiver |
| Datenrate | 10/100 Mbps | — |
| Network Standard | IEEE 802.3 10BASE-T, 100BASE-TX | — |
| MAC Interface | MII, RMII, RGMII | — |
| Gehäuse | 32-pin VQFN (RHB) 5 mm × 5 mm | 32-pin VQFN |
| ESD Protection (HBM) | 16 kV on MDI pins | — |
| Versorgungsspannung | 3.3 V (I/O), 1.8 V or 3.3 V (analog) | — |
| Power Consumption (Active Link) | [DATA_NEEDED: typical active-link power] | — |
| Power-Down Mode | Energy Detect, <10 mW | — |
| Energy Efficient Ethernet | IEEE 802.3az (EEE) | — |
| Wake-on-LAN | Yes (Magic Packet) | — |
| Cable Diagnostics | TDR-based cable-length and fault detection | — |
| Reference Clock | 25 MHz crystal or oscillator input | — |
| Betriebstemperaturbereich | -40 °C to +125 °C (industrial, HRHB) | -40 °C to +125 °C |
| Junction-to-Ambient Thermal Resistance (θJA) | [DATA_NEEDED: θJA for VQFN-32 5x5] | — |
| Montageart | Surface Mount | Surface mount |
| MSL (Moisture Sensitivity Level) | [DATA_NEEDED: MSL rating] | — |
| RoHS-Status | Compliant | Compliant |
| Lead-Free | Yes | — |
| Supported Data Rates | — | 10/100 Mbps |
| Host Interface | — | MII, RGMII, RMII |
| Cable Media | — | Standard twisted-pair cable; external fiber-optic transceiver supported |
| ESD Protection | — | 16 kV |
| Temperature Classification | — | Extended temperature |
| Package Dimensions | — | 5.00 mm × 5.00 mm |
| Power-Saving Features | — | Energy Efficient Ethernet, Wake-on-LAN, and programmable energy-saving modes |
| Design Philosophy | — | Robust, low-power |
| Reference Design | — | Cost-optimized high-EMC-immunity EtherCAT slave with dual ports and SPI interface to the application processor |
| Documented Upgrade Path | — | Pin-to-pin upgradeable option for TLK105, TLK106, TLK105L, and TLK106L |
| REACH Status | — | unknown |
| AEC-Q100 Qualification | — | not_applicable |
| Moisture Sensitivity Level | — | MSL 2, 260 °C, 1 year |