DSP56321VF200 vs DSP56321VL220557 Vergleich

Detaillierter Direktvergleich von DSP56321VF200 von NXP Semiconductors und DSP56321VL220557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
DSP56321VF200 DSP56321VF200 - 24-Bit 200MHz DSP with EFCOP | NXP

DSP56321VF200 - 24-Bit 200MHz DSP with EFCOP | NXP

DSP56321VF200 ✗ Abgekündigt
NXP Semiconductors
DSP56321VL220557 DSP56321VL220557 - 24-Bit DSP, 220MHz, MAPBGA-196 | NXP

DSP56321VL220557 - 24-Bit DSP, 220MHz, MAPBGA-196 | NXP

DSP56321VL220557 ✓ Aktiv

Spezifikationsvergleich

Parameter DSP56321VF200 DSP56321VL220557
Marke NXP Semiconductors NXP Semiconductors
Kategorie DSP DSP
Lebenszyklusstatus Ende des Lebenszyklus Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $62,00 $1,64
Part Number DSP56321VF200 —
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Product Type Fixed-Point Digital Signal Processor (DSP) Digital Signal Processor (DSP)
DSP Family DSP56300 family, DSP56000 code-compatible —
Core Architecture 24-bit fixed-point, single-cycle engine —
Clock Speed 200 MHz —
On-Chip RAM 576 KB —
Bootstrap ROM 576 bytes —
Instruction Cache Yes —
Coprocessor Enhanced Filter Coprocessor (EFCOP) —
DMA Channels 6 channels 4 independent channels
Addressing 24-bit address space, barrel shifter —
Interfaces Host Interface, SSI (Synchronous Serial), SCI (Serial Communications) —
I/O Voltage 3.30 V —
Gehäuse 196-MAPBGA (15 mm x 15 mm, 1 mm pitch, 1.18 mm body height) MAPBGA-196 (15x15 mm)
Montageart Surface Mount (BGA) Surface Mount
Betriebs-Sperrschichttemperatur -40C to +100C (TJ) —
Packaging Tray —
Architecture — 24-bit fixed-point DSP56300 family
Core Clock Frequency — 220 MHz
Instruction Cycle Time — 15 ns
Data Word Width — 24-bit
Accumulator Width — 56-bit
On-chip Memory — Program ROM/RAM and Data RAM (see datasheet)
DMA Controller — Yes
External Memory Interface — Yes (SRAM / DRAM expansion)
Enhanced Filter Co-Processor — EFCOP for sample-rate conversion
Host Interface — Asynchronous serial / parallel ports
Serial Audio Interface — Yes (ESSI / SCI)
Timers — Triple timer module
Betriebstemperaturbereich — -40C to +85C (industrial)
I/O Logic Level — TTL-compatible
Process Technology — High-density CMOS
RoHS-Status — Compliant

Datenblätter & Ressourcen

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