DSP56321VL220557 vs DSP56321VL220 Vergleich
Detaillierter Direktvergleich von DSP56321VL220557 von NXP Semiconductors und DSP56321VL220 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DSP56321VL220557 | DSP56321VL220 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | DSP | DSP |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $1,64 | $23,90 |
| Product Type | Digital Signal Processor (DSP) | — |
| Architecture | 24-bit fixed-point DSP56300 family | — |
| Core Clock Frequency | 220 MHz | 220 MHz |
| Instruction Cycle Time | 15 ns | — |
| Data Word Width | 24-bit | — |
| Accumulator Width | 56-bit | — |
| On-chip Memory | Program ROM/RAM and Data RAM (see datasheet) | — |
| DMA Channels | 4 independent channels | 6 |
| DMA Controller | Yes | — |
| External Memory Interface | Yes (SRAM / DRAM expansion) | — |
| Enhanced Filter Co-Processor | EFCOP for sample-rate conversion | — |
| Host Interface | Asynchronous serial / parallel ports | Serial Host Interface (SHI) + Host Port |
| Serial Audio Interface | Yes (ESSI / SCI) | — |
| Timers | Triple timer module | Triple Timer module |
| Betriebstemperaturbereich | -40C to +85C (industrial) | — |
| I/O Logic Level | TTL-compatible | — |
| Process Technology | High-density CMOS | — |
| Gehäuse | MAPBGA-196 (15x15 mm) | 196-ball MAPBGA (15 x 15 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Compliant | — |
| Core Architecture | — | DSP56300 family, 24-bit fixed-point |
| Instruction Throughput | — | 220 MIPS |
| Internal Core Voltage | — | 1.8 V |
| I/O Voltage | — | 3.3 V |
| Program Address Space | — | 16M x 24-bit words |
| Data Address Space (X/Y) | — | 16M x 24-bit words (each) |
| On-chip Program RAM | — | [DATA_NEEDED: program RAM size in words] |
| On-chip Data RAM | — | [DATA_NEEDED: X/Y data RAM size in words] |
| Instruction Cache | — | Yes (configurable) |
| Audio Interface | — | Enhanced Serial Audio Interface (ESAI) |
| Communication Interface | — | Serial Communication Interface (SCI) |
| Bootstrap ROM | — | Yes (flashless boot) |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Lead Free / RoHS | — | Lead-free (PBFREE), RoHS compliant |