DSP56F827FG80E vs DSP56F826BU80E Vergleich
Detaillierter Direktvergleich von DSP56F827FG80E von NXP Semiconductors und DSP56F826BU80E von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | DSP56F827FG80E | DSP56F826BU80E |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | DSP |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $29,25 | $1,00 |
| Core | 56800 (56F8xx family) | 56800E (16-bit) |
| Core Size | 16-bit | — |
| Core Frequency | 80 MHz | 80 MHz |
| Performance | 40 MIPS at 80 MHz | 40 MIPS |
| Program Flash | 128KB (64K x 16) | — |
| Program RAM | [DATA_NEEDED: Program RAM size] | — |
| Data RAM | [DATA_NEEDED: Data RAM size] | — |
| Data Flash | [DATA_NEEDED: Data Flash size] | — |
| Versorgungsspannung | [DATA_NEEDED: Supply voltage range] | [DATA_NEEDED: supply voltage range] |
| Betriebstemperatur | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| Oscillator | 4 MHz crystal oscillator with PLL (integrated pre- and post-scalers) | — |
| ADC | Dual Analog to Digital Converters | — |
| Timers | Quad Timer | Quad Timer |
| Communications Interfaces | SCI, SPI, SSI | — |
| Debug Interface | JTAG / OnCE Debug Programming Interface | JTAG/OnCE |
| Other Peripherals | Time-of-Day module, GPIO, hardware DO and REP loops | — |
| Gehäuse | 128-LQFP (14 x 20 mm) | 100-LQFP (14 x 14 mm) |
| Montageart | Surface Mount | Surface Mount |
| Lebenszyklusstatus | End of Life (per NXP product page) | — |
| Program Memory | — | 64KB (32K x 16) Flash |
| RAM Size | — | 4.5K x 16 |
| Datenbusbreite | — | 16-bit |
| Number of I/O | — | 46 |
| Oscillator Type | — | External (4 MHz crystal with PLL) |
| Serial Interfaces | — | SCI, SPI, SSI |
| I/O Tolerance | — | 5V-tolerant, TTL-compatible inputs |
| Process Technology | — | High-density CMOS |
| Packaging | — | Tray |