EP1AGX50CF484C3 vs EP1AGX35CF484C6N Vergleich
Detaillierter Direktvergleich von EP1AGX50CF484C3 von Intel und EP1AGX35CF484C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1AGX50CF484C3 | EP1AGX35CF484C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $218,00 | $118,00 |
| Family | Arria GX | Arria GX |
| Logic Elements | 50,160 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total RAM Bits | 2,475,072 bits | — |
| M4K Memory Blocks | 4,506 | — |
| M-RAM Blocks | 252 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Transceiver Channels | 12 (up to 3.125 Gbps) | — |
| User I/O Pins | 232 | 230 |
| Gehäuse | 484-ball FBGA (FineLine BGA) | 484-pin FC-FBGA (Flip-Chip BGA) |
| Speed Grade | C3 (commercial, fastest) | C6 (commercial) |
| Betriebstemperatur | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Core Voltage | 1.2 V | — |
| Configuration Method | Passive serial, Fast passive parallel, JTAG | — |
| RoHS-Status | Compliant | — |
| Process Technology | 90 nm | 90 nm |
| Logic Elements (LE) | — | 33,520 |
| Embedded Memory | — | 1,348,416 bits |
| Core Supply Voltage | — | 1.2 V |
| Transceivers | — | 4 channels, 600 Mbps to 3.125 Gbps |
| DSP Blocks | — | 18x18 multipliers |
| Memory Blocks | — | M9K and M-RAM |
| I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Montageart | — | Surface Mount |
| MSL-Level | — | [DATA_NEEDED: MSL level] |