EP1AGX60DF780C6N vs EP1AGX60DF780C7 Vergleich
Detaillierter Direktvergleich von EP1AGX60DF780C6N von Intel und EP1AGX60DF780C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1AGX60DF780C7 - Arria GX FPGA, 60K LE, 780-BGA | Intel (Altera)
EP1AGX60DF780C7 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1AGX60DF780C6N | EP1AGX60DF780C7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $142,00 | $195,00 |
| Series | Arria GX | Arria GX |
| Family | EP1AGX60 | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 60,100 | 60,100 |
| Logic Array Blocks (LABs) | 3,005 | — |
| Embedded Memory Bits | 2,528,640 | — |
| Maximum User I/O | 350 | — |
| Transceivers | 8 (3.125 Gbps each) | Up to 8 multi-gigabit transceivers |
| Betriebsversorgungsspannung | 1.15 V to 1.25 V (core) | — |
| Process Technology | 90 nm | — |
| Maximum Frequency | 622.08 MHz | — |
| Datenrate | 3.125 Gbps | — |
| Gehäuse | 780-BBGA, FCBGA (29 mm x 29 mm, 1 mm pitch) | 780-BBGA, FC (Flip-Chip) FineLine BGA |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0C to +85C (commercial grade, 'C') | 0C to +85C (commercial) |
| Speed Grade | 6 | C7 (commercial) |
| RoHS-Status | [DATA_NEEDED: rohs_status] | [DATA_NEEDED: RoHS status] |
| Embedded Memory | — | 2,528,640 bits |
| Total Block Memory Bits | — | 2,528,640 |
| Process Node | — | 90 nm |
| Core Voltage | — | 1.2 V |
| I/O Voltage | — | 2.5 V / 3.3 V (LVTTL/LVCMOS/LVDS/SSTL) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |
| User I/O Pins | — | [DATA_NEEDED: max user I/O count] |
| PLLs | — | [DATA_NEEDED: PLL count] |
| MSL-Level | — | [DATA_NEEDED: MSL moisture sensitivity level] |