EP1C12F256C6 vs EP1C12F256C8 Vergleich
Detaillierter Direktvergleich von EP1C12F256C6 von Intel und EP1C12F256C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F256C6 | EP1C12F256C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $48,29 | $35,20 |
| Series | Cyclone I | Cyclone |
| Logic Elements | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Embedded RAM Bits | 239,616 bits (52 M4K blocks) | — |
| Embedded 18x18 Multipliers | 17 | — |
| Maximum User I/Os | 185 | — |
| PLLs | 2 | — |
| Process Technology | 130 nm SRAM, 1.5 V core | 130 nm SRAM |
| Gehäuse | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) | — |
| Betriebstemperatur | 0C to +85C (commercial, C6 speed grade) | 0°C to +85°C (commercial grade) |
| Speed Grade | C6 (mid-tier) | — |
| Configuration Modes | Active Serial (AS), Passive Serial (PS), JTAG | — |
| I/O Standards Supported | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI | — |
| LVDS Data Rate | Up to 640 Mbps | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Family | — | Cyclone I |
| Logic Elements (LE) | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Number of LABs/CLBs | — | 1,206 |
| Number of Logic Elements/Cells | — | 12,060 |
| Number of I/O | — | 185 |
| Number of PLLs | — | 2 |
| Total Memory Bits | — | 239,616 |
| Gehäuse / Bauform | — | 256-BGA (FBGA) |
| Core Voltage | — | 1.5 V |
| I/O Voltage Range | — | 1.5 V to 3.3 V |
| Supplier Device Package | — | 256-FBGA (17x17 mm) |
| Configuration Method | — | Passive Serial / Active Serial / JTAG |