EP1C12F256C6N vs EP1C12F256C6 Vergleich
Detaillierter Direktvergleich von EP1C12F256C6N von Intel und EP1C12F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Letzte Bestellmöglichkeit
Spezifikationsvergleich
| Parameter | EP1C12F256C6N | EP1C12F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $51,90 | $48,29 |
| Family | Cyclone® | — |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | 1,206 |
| Embedded Memory Bits | 239,616 bits | — |
| M4K RAM Blocks | 52 | — |
| Embedded 18x18 Multipliers | Yes | 17 |
| PLLs | 2 | 2 |
| Maximum User I/O | 185 | — |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 0.13 µm SRAM | 130 nm SRAM, 1.5 V core |
| Gehäuse | 256-ball FBGA (F256) | 256-BGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | 0C to +85C (commercial, C6 speed grade) |
| Speed Grade | 6 | C6 (mid-tier) |
| Configuration Method | Serial (EPCS) / JTAG | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | — | Cyclone I |
| Logic Elements | — | 12,060 |
| Embedded RAM Bits | — | 239,616 bits (52 M4K blocks) |
| Maximum User I/Os | — | 185 |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| I/O Standards Supported | — | LVTTL, LVCMOS, LVDS, SSTL-2/3, PCI |
| LVDS Data Rate | — | Up to 640 Mbps |