EP1C12F256C6N vs EP1C12F256I7 Vergleich
Detaillierter Direktvergleich von EP1C12F256C6N von Intel und EP1C12F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1C12F256C6N - 12,060 LEs Cyclone FPGA 256-BGA | Intel / Altera
EP1C12F256C6N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1C12F256C6N | EP1C12F256I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $51,90 | $49,95 |
| Family | Cyclone® | Cyclone (1st generation) |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | 1,206 |
| Embedded Memory Bits | 239,616 bits | — |
| M4K RAM Blocks | 52 | — |
| Embedded 18x18 Multipliers | Yes | — |
| PLLs | 2 | — |
| Maximum User I/O | 185 | — |
| User I/O Banks | [DATA_NEEDED: number of user I/O banks] | — |
| Core Voltage (VCCINT) | 1.5 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) | — |
| Process Technology | 0.13 µm SRAM | 130 nm |
| Gehäuse | 256-ball FBGA (F256) | 256-ball FBGA (FineLine BGA) |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | — |
| Speed Grade | 6 | 7 |
| Configuration Method | Serial (EPCS) / JTAG | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements | — | 12,060 |
| Total RAM Bits | — | 239,616 |
| Embedded Memory Blocks | — | M4K (4,608 bits each) |
| Number of PLLs | — | 2 |
| User I/O Count | — | 185 |
| Core Voltage | — | 1.5 V |
| Package Dimensions | — | 17 mm x 17 mm |
| Ball Pitch | — | 1.0 mm |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |