EP1C12F324C7N vs EP1C12F324C8 Vergleich
Detaillierter Direktvergleich von EP1C12F324C7N von Intel und EP1C12F324C8 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C12F324C7N | EP1C12F324C8 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $37,20 | $21,50 |
| Series | Cyclone | Cyclone |
| Family | Cyclone I | Cyclone I (EP1C12) |
| Manufacturer | Intel (formerly Altera) | Intel (formerly Altera) |
| Logic Elements (LEs) | 12,060 | — |
| Logic Array Blocks (LABs) | 1,206 | — |
| Embedded Memory (bits) | 239,616 | — |
| Maximum User I/O | 249 | — |
| Number of PLLs | 2 | 2 |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| Core Voltage | 1.5 V | 1.5 V |
| Betriebsversorgungsspannung | 1.5 V to 3.3 V | — |
| Maximum Internal Frequency | 320 MHz | — |
| Speed Grade | C7 (commercial, -40C to 85C; spec datasheet: 0C to 85C) | C8 (commercial, slowest speed bin) |
| Gehäuse / Bauform | 324-BGA (FBGA-324, 19 x 19 mm, 1.0 mm pitch) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Method | AS / PS / JTAG | SRAM-based, external configuration device (EPCS series) |
| RoHS-Status | Compliant (N suffix = lead-free) | Compliant (per DigiKey listing) |
| Betriebstemperatur | [DATA_NEEDED: precise commercial temperature range per datasheet] | 0C to +85C (commercial) |
| Number of Logic Elements (LEs) | — | 12060 |
| Number of LABs/CLBs | — | 1206 |
| Total Embedded Memory | — | 239616 bits |
| Number of I/O Pins | — | 249 |
| Gehäuse | — | 324-FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| I/O Voltage | — | Up to 3.3 V (LVTTL/LVCMOS/SSTL/LVDS/PCI) |
| Maximum Internal Clock Frequency | — | 275 MHz (C8 speed grade) |
| Lead-Free | — | Yes |