EP1C6F256C7N vs EP1C6F256C6 Vergleich
Detaillierter Direktvergleich von EP1C6F256C7N von Intel und EP1C6F256C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1C6F256C7N | EP1C6F256C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $38,90 |
| Series | Cyclone | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 5,980 | — |
| Total RAM Bits | 92,160 | 92,160 |
| User I/O Count | 185 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Number of PLLs | 2 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | [DATA_NEEDED: embedded multiplier count] |
| Core Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 µm SRAM, all-layer copper | 0.13 µm SRAM |
| Speed Grade | -7 (C7) | C6 |
| Betriebstemperatur | 0C to +85C (commercial) | 0 °C to 85 °C (commercial) |
| Package Type | 256-ball FineLine BGA (FBGA-256) | — |
| Package Dimensions | 17 mm x 17 mm | 17 mm × 17 mm |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS-Status | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | — |
| Family | — | Cyclone |
| Logic Elements | — | 5,980 |
| Logic Array Blocks (LABs) | — | 598 |
| User I/O Pins | — | 185 |
| PLLs | — | 2 |
| Gehäuse | — | 256-ball FineLine BGA (FBGA) |
| Configuration Method | — | JTAG, serial (EPCS), passive serial |