EP1C6F256C7N vs EP1C6F256C6N Vergleich
Detaillierter Direktvergleich von EP1C6F256C7N von Intel und EP1C6F256C6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1C6F256C6N - Cyclone 6K LEs FPGA, 185 I/O, FBGA-256 | Intel
EP1C6F256C6N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1C6F256C7N | EP1C6F256C6N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $18,20 | $21,80 |
| Series | Cyclone | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 5,980 | — |
| Total RAM Bits | 92,160 | — |
| User I/O Count | 185 | — |
| Number of Logic Array Blocks (LAB) | [DATA_NEEDED: LAB count] | — |
| Number of PLLs | 2 | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Core Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.13 µm SRAM, all-layer copper | 0.13 µm SRAM |
| Speed Grade | -7 (C7) | 6 |
| Betriebstemperatur | 0C to +85C (commercial) | 0 °C to +85 °C (commercial) |
| Package Type | 256-ball FineLine BGA (FBGA-256) | — |
| Package Dimensions | 17 mm x 17 mm | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Configuration Mode | Passive Serial (PS), Active Serial (AS), JTAG | — |
| RoHS-Status | Compliant | Compliant (Pb-free) |
| Lead-Free | Yes | — |
| Family | — | Cyclone |
| Logic Elements (LEs) | — | 5,980 |
| Embedded RAM Bits | — | 92,160 |
| User I/O Pins | — | 185 |
| Gehäuse | — | 256-BGA (FBGA-256) |
| PLLs | — | 2 |
| Logic Array Blocks (LABs) | — | 598 |
| Configuration Method | — | JTAG / Active Serial |
| I/O Standards | — | LVTTL, LVCMOS, SSTL, LVDS |