EP1K50TI144-1X vs EP1C6T144C8N Vergleich

Detaillierter Direktvergleich von EP1K50TI144-1X von Intel und EP1C6T144C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1K50TI144-1X EP1C6T144C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,95 $12,95
Family ACEX 1K Cyclone I
Series EP1K50 Cyclone®
Device Type FPGA (Field Programmable Gate Array) —
Equivalent Gates 50,000 —
Logic Elements / Cells 2,880 —
Configurable Logic Blocks (CLBs) 360 —
Maximum User I/O Pins 102 —
Dedicated Input Pins 6 —
Number of Terminals 144 —
Package Code QFP / TQFP-144 (Industrial) —
Package Style Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch —
Terminal Form Gull Wing —
Supply Voltage (VCCINT) 2.375 V to 2.625 V (nominal 2.5 V) —
Maximale Taktfrequenz 90 MHz —
Betriebstemperatur -40 C to +85 C (Industrial) 0°C to +85°C (commercial)
Configuration Method Volatile SRAM, external configuration device required Active Serial (EPCS), Passive Serial, JTAG
Montageart Surface Mount Surface Mount
RoHS-Status [DATA_NEEDED: RoHS status] Compliant
Speed Grade -1 (slowest, lowest cost) C8 (commercial)
Design Toolchain Quartus II (legacy support) —
Logic Elements (LE) — 5,980
Logic Array Blocks (LAB) — 598
Total RAM Bits — 92,160
User I/O Pins — 98
Number of I/O Banks — 4
PLLs — 2
Maximum Internal Frequency — 275 MHz
Core Voltage (VCCINT) — 1.425 V to 1.575 V (typ. 1.5 V)
Process Technology — 0.13 µm all-layer copper SRAM
Gehäuse — 144-pin TQFP
MSL-Level — 3 (per JEDEC J-STD-020)

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern