EP1K50TI144-3 vs EP1K50TI144-1X Vergleich

Detaillierter Direktvergleich von EP1K50TI144-3 von Intel und EP1K50TI144-1X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1K50TI144-3 EP1K50TI144-1X
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $10,40 $10,95
Family ACEX 1K ACEX 1K
Logic Elements (LEs) 2,880 —
Typical Gate Count 50,000 —
Configurable Logic Blocks (CLBs) 360 360
Embedded Array Blocks (EABs) 72 —
Embedded RAM Bits 40,960 —
Maximum User I/O Pins 102 102
Dedicated Input Pins 6 6
Speed Grade -3 -1 (slowest, lowest cost)
Propagation Delay (typical) 12.5 ns —
Supply Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V nominal) 2.375 V to 2.625 V (nominal 2.5 V)
Operating Temperature (industrial) -40 C to +85 C —
Gehäuse 144-pin PQFP (TQFP, TI suffix) —
Process Technology 0.22 µm CMOS SRAM —
Configuration Interface JTAG (IEEE 1149.1) + serial/parallel —
RoHS-Status [DATA_NEEDED: RoHS status of legacy ACEX 1K] [DATA_NEEDED: RoHS status]
Series — EP1K50
Device Type — FPGA (Field Programmable Gate Array)
Equivalent Gates — 50,000
Logic Elements / Cells — 2,880
Number of Terminals — 144
Package Code — QFP / TQFP-144 (Industrial)
Package Style — Low-profile Fine-pitch Quad Flat Pack (LFQFP / LQFP), 0.5 mm pitch
Terminal Form — Gull Wing
Maximale Taktfrequenz — 90 MHz
Betriebstemperatur — -40 C to +85 C (Industrial)
Configuration Method — Volatile SRAM, external configuration device required
Montageart — Surface Mount
Design Toolchain — Quartus II (legacy support)

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