EP1M120B484C5 vs EP1M120B484C6 Vergleich
Detaillierter Direktvergleich von EP1M120B484C5 von Intel und EP1M120B484C6 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M120B484C5 | EP1M120B484C6 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $65,00 | $55,00 |
| Family | Mercury (EP1M) | Mercury (ACEX 1M) |
| Logic Elements | 4,800 | — |
| Typical Gates | 120,000 | — |
| Maximum User I/O | 303 | — |
| Gehäuse | FineLine BGA-484 (19 mm x 19 mm, 1.0 mm pitch) | 484-ball FineLine BGA (BGA-484) |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Speed Grade | 5 (slowest) | — |
| Core Voltage | 1.8 V | — |
| Process Technology | 0.18 um CMOS | — |
| PLLs | 4 | — |
| Embedded RAM Bits | 49,152 | — |
| True LVDS Channels | Up to 34 pairs | — |
| Maximum LVDS Data Rate | 840 Mbps per channel | — |
| Configuration Scheme | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG | — |
| Peak Reflow Temperature | 220 C | 220 °C |
| Lead-Free / RoHS | SnPb ball finish (non-RoHS by default) | — |
| Multipliers | Embedded in system blocks for DSP | — |
| Montageart | Surface Mount | Surface Mount |
| Logic Elements (typical) | — | 120 LE |
| Maximum Logic Elements | — | [DATA_NEEDED: maximum logic elements] |
| Flip-Flops | — | 4,800 |
| User I/O Pins (max) | — | 303 |
| Configuration Memory | — | SRAM-based (volatile, re-load on power-up) |
| Operating Temperature Grade | — | Commercial (C suffix) |
| Process Node | — | 0.18 µm |
| JTAG Support | — | IEEE 1149.1 boundary-scan |
| Configuration Modes | — | PS, AS, JTAG |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |
| Design Software | — | Quartus II (legacy support required) |