EP1M350F780C7 vs EP1M350F780I6AA Vergleich
Detaillierter Direktvergleich von EP1M350F780C7 von Intel und EP1M350F780I6AA von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1M350F780C7 | EP1M350F780I6AA |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $165,00 |
| Family | Mercury (PLD) | Mercury |
| Device Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Logic Array Blocks (LABs) | 1440 | — |
| System Gates | 350,000 | — |
| Maximum User I/Os | 486 | — |
| Gehäuse | 780-ball FineLine BGA (F780) | 780-Ball FC-FBGA |
| Package Type | FINE LINE BGA-780 | — |
| Supply Voltage (Core) | 1.8 V | — |
| Logic Family | CMOS | — |
| Betriebstemperatur | 0 C to 85 C (Commercial) | — |
| Montageart | Surface Mount | Surface Mount |
| Transceivers / CDR Support | Up to 1.25 Gbps with CDR | — |
| Configuration Method | JTAG / Quartus II | Serial / Parallel via EPC configuration device |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| MSL-Level | [DATA_NEEDED: MSL rating] | — |
| Process Technology | CMOS SRAM-based | 0.13 µm CMOS |
| Device Logic Elements / Cells | — | 14,400 |
| Number of Gates | — | 350K system gates |
| Betriebsversorgungsspannung | — | 1.8 V core |
| User I/O Count | — | 486 |
| Speed Grade | — | 6 (slowest) |
| Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free Assembly | — | Yes (AA suffix) |
| Embedded Transceivers | — | Yes (high-speed differential with CDR support) |
| Supplier Device Package | — | 780-FBGA |