EP1S20F672C7N vs EP1S20B672C7N Vergleich
Detaillierter Direktvergleich von EP1S20F672C7N von Intel und EP1S20B672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP1S20F672C7N | EP1S20B672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $109,20 | $320,00 |
| Series | Stratix (first generation) | Stratix |
| Family | Stratix | Stratix (original) |
| Logic Elements (LEs) | 18,460 | 18,460 |
| Logic Cells | 18,460 | — |
| Configurable Logic Blocks (CLBs) | 2,132 | — |
| Embedded Memory (TriMatrix) | 1,669,248 bits (426 Kbit total) | — |
| DSP Blocks | 56 (dedicated 18x18 multipliers) | — |
| Maximum User I/O | 586 | 426 |
| I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| PLLs | Up to 12 | — |
| Maximum Operating Frequency | 420.17 MHz | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS | 0.13 µm CMOS |
| Gehäuse | 672-FBGA (FineLine BGA) | — |
| Package Body Size | 35 mm x 35 mm | — |
| Ball Pitch | 1.27 mm | — |
| Betriebstemperatur | 0°C to +85°C (commercial) | 0 °C to 85 °C (Commercial Extended) |
| Speed Grade | C7 (-7) | -7 |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Lead-Free / RoHS | Yes (lead-free finish, RoHS compliant) | — |
| Configuration Modes | PS, PPS, FPP, JTAG | — |
| MSL-Level | [DATA_NEEDED: moisture sensitivity level] | 3 (per JEDEC J-STD-020) |
| LABs / CLBs | — | 1,846 |
| Embedded Memory Bits | — | 1,669,248 bits |
| Number of Pins / Balls | — | 672 |
| Package Type | — | 672-BBGA (Fine-pitch BGA, 35 × 35 mm, 1.27 mm pitch) |
| Supply Voltage (Core, VCCINT) | — | 1.5 V |
| Logic Family | — | CMOS |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance] |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |