EP1SGX10DF672I6 vs EP1SGX10DF672C5N Vergleich
Detaillierter Direktvergleich von EP1SGX10DF672I6 von Intel und EP1SGX10DF672C5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
EP1SGX10DF672C5N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1SGX10DF672I6 | EP1SGX10DF672C5N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $290,00 | $192,00 |
| Family | Stratix GX | Stratix GX |
| Logic Elements (LEs) | 10,570 | — |
| Embedded RAM | 920,448 bits | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Transceiver Channels | 12 (3.125 Gbps) | — |
| Maximum User I/O | 362 | — |
| PLLs | 4 | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| Betriebstemperatur | 0 C to +85 C (commercial) | 0 C to 85 C (Commercial) |
| Gehäuse | 672-ball FC-FBGA (DF672) | 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| Package Body Size | 33 x 33 mm, 1.0 mm pitch | — |
| Montageart | Surface Mount | Surface Mount (Flip-Chip BGA) |
| MSL-Level | [DATA_NEEDED: MSL Level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS Status] | Compliant (FBGA package) |
| Logic Cells | — | 10,570 |
| Logic Array Blocks (LABs) | — | 1,057 |
| Configurable Logic Blocks | — | 1,200 |
| User I/Os | — | 362 |
| On-chip RAM | — | 920,448 bits |
| Supply Voltage (Core, VCCINT) | — | 1.5 V nominal (1.425 V to 1.575 V) |
| Technology | — | 130 nm CMOS |
| Logic Family | — | CMOS |
| Configuration | — | Passive Serial / Passive Parallel / JTAG / Altera Serial |
| High-Speed Transceivers | — | Embedded GX transceivers (data rate not specified in provided data [DATA_NEEDED: transceiver count and max data rate]) |