EP1SGX25DF672C5N vs EP1SGX25DF672I5N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF672C5N von Intel und EP1SGX25DF672I5N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP1SGX25DF672I5N EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N - Stratix GX FPGA, 25.6K LE, 3.1875Gbps SERDES

EP1SGX25DF672I5N ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP1SGX25DF672C5N EP1SGX25DF672I5N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.232,25 $118,00
Series Stratix GX —
Logic Elements 25,660 LE 25,660
User I/O Count 455 —
Total RAM Bits 1,944,576 bits —
Supply Voltage (Core) 1.5 V (1.425 V to 1.575 V) —
Transceiver Data Rate Up to 3.1875 Gbps —
Number of Transceivers 20 —
DSP Blocks 10 (dedicated 18x18 multipliers) —
Package Type 672-ball Flip-Chip BGA (FBGA-672) —
Package Dimensions 27 mm x 27 mm, 1.0 mm pitch —
Betriebstemperatur 0 C to 85 C (Commercial) -40C to +85C (Industrial)
Speed Grade C5 —
Process Technology 130 nm CMOS 130 nm CMOS
Configuration Modes PS, PPS, FPP, JTAG —
Montageart Surface Mount (FBGA) Surface Mount
Lead Free / RoHS Lead free per Altera/Intel datasheet —
Family — Stratix GX
Logic Cells (CLBs) — 2,566
Core Supply Voltage — 1.5 V
High-Speed Transceiver Channels — 4 to 20 (CDR/SERDES)
Max Transceiver Data Rate — 3.1875 Gbps
Gehäuse — 672-ball FC-FBGA
Package Body Size — 33 x 33 mm
Ball Pitch — 1.0 mm
Lead-Free — Yes
RoHS-Status — Compliant
Logic Family — CMOS (SRAM-based FPGA)
Total I/O Pins — [DATA_NEEDED: total user I/O pin count]
Embedded Memory — [DATA_NEEDED: TriMatrix memory block count]

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