EP1SGX25DF672C7ES vs EP1SGX25DF672I7 Vergleich

Detaillierter Direktvergleich von EP1SGX25DF672C7ES von Intel und EP1SGX25DF672I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF672C7ES EP1SGX25DF672I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $1.190,00
Product Type Field Programmable Gate Array (FPGA) —
Device Family Stratix GX —
Logic Cells 25,660 cells —
Logic Family CMOS —
Process Technology 130 nm CMOS 130 nm
Versorgungsspannung 1.5 V —
I/O Count 455 I/O —
Listed Clock Frequency 4385.97 MHz —
Secondary Listed Maximum Clock 4.7 MHz —
High-Speed Serial Data Rate 500 Mbps to 3.1875 Gbps —
High-Speed Serial Direction Full-duplex —
Available Family Transceiver Configurations 4, 8, 16, or 20 channels —
Maximum Family Transceiver Bandwidth 127.5 Gbps full-duplex —
Gehäuse 672-pin FC-FBGA —
Alternate Package Description FBGA-1020, 33 mm x 33 mm, 1 mm pitch —
Betriebstemperatur 0 °C to 85 °C —
Lead-Free Status Lead-free —
Series — Stratix GX
Family — Stratix GX (EP1SGX25)
Logic Elements — 25,660
Configurable Logic Blocks (CLBs) — 2,566
Total RAM Bits — 1,944,576
Number of Logic Array Blocks (LABs) — 455
Maximum Internal Clock Frequency — 4385.97 MHz
Combinatorial CLB Delay (max) — 9.48 ns
Nominal Supply Voltage — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Operating Temperature Grade — MILITARY / Industrial
Speed Grade — I7 (slowest industrial)
Package Code — DF (672-ball FC-FBGA)
Number of Terminals — 672
Terminal Form — Ball (BGA)
Package Shape — Square
Montageart — Surface Mount (BGA)
RoHS-Status — [DATA_NEEDED: RoHS status]

Datenblätter & Ressourcen

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