EP1SGX25DF672I7N vs EP1SGX25DF672C7N Vergleich
Detaillierter Direktvergleich von EP1SGX25DF672I7N von Intel und EP1SGX25DF672C7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP1SGX25DF672I7N | EP1SGX25DF672C7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $245,00 |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 |
| CLBs | 2,566 | — |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) | — |
| Combinatorial Delay (CLB) | 9.48 ns max | — |
| Process Technology | 130 nm CMOS | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 | — |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel | — |
| Core Supply Voltage (VCCINT) | 1.5 V | — |
| Supply Voltage Range | 1.425 V to 1.575 V | — |
| Gehäuse | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch | 672-ball FineLine BGA (FBGA-672) |
| Logic Family | CMOS | — |
| Betriebstemperatur | 0 °C to 85 °C (industrial) | 0 °C to 85 °C (Commercial) |
| Lead-Free | Yes | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | Compliant |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Terminal Form | Ball (BGA) | — |
| Number of Terminals | 672 | — |
| Series | — | Stratix GX |
| Embedded Memory | — | 1,944,576 bits |
| Maximum User I/O | — | 455 |
| Number of Transceivers | — | 4 |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Core Supply Voltage | — | 1.5 V |
| Package Dimensions | — | 33 × 33 mm, 1 mm pitch |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Speed Grade | — | C7 |