EP1SGX25DF800C5N vs EP1SGX25DF800I6N Vergleich

Detaillierter Direktvergleich von EP1SGX25DF800C5N von Intel und EP1SGX25DF800I6N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP1SGX25DF800C5N EP1SGX25DF800I6N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $158,00 $1.450,00
Family Stratix GX Stratix GX
Device Logic Elements 25,660 (typical) —
Transceiver Channels 8 (full-duplex) 4 to 20 channels
Maximum Transceiver Data Rate 3.1875 Gbps per channel 3.1875 Gbps per channel
Process Technology 130 nm —
Supply Voltage (Core) 1.5 V typical —
Gehäuse FBGA-800 (FineLine BGA, 31x31 mm) 800-pin FineLine BGA (DF800)
Speed Grade C5 (commercial) -6 (production grade)
Betriebstemperatur 0C to +85C (commercial) —
Lead-Free / RoHS Status Lead-free (N suffix) —
On-Chip Memory (TriMatrix) Approx. 2 Mbits total —
PLLs Up to 40 (device-wide) —
Embedded 8b/10b Encoder/Decoder Yes (one per transceiver channel) —
PCI Express Hard IP x1, x4 endpoints supported —
DSP Blocks Embedded multiplier blocks (family-wide) Up to 22 DSP blocks
Montageart Surface Mount (BGA) —
MSL-Level [DATA_NEEDED: MSL Level] —
Development Software Quartus II (legacy) —
Logic Elements — [DATA_NEEDED: logic element count]
CDR / SERDES — Embedded clock-data recovery and SERDES
Memory — TriMatrix memory, up to 2 Mbits
Hard IP — PCI Express PHY, external memory interfaces (DDR, DDR-II, QDR-II, RLDRAM-II)
Source-Synchronous Channels — 8 channels
I/O Standards — LVDS, LVTTL, LVCMOS, SSTL, HSTL
Temperature Range — Industrial -40C to +100C
RoHS-Status — [DATA_NEEDED: RoHS status]
Protocol Support — Gigabit Ethernet, SONET/SDH, PCI Express, custom serial

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern