EP20K100CF144C9 vs EP20K100CF324C7 Vergleich

Detaillierter Direktvergleich von EP20K100CF144C9 von Intel und EP20K100CF324C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP20K100CF144C9 EP20K100CF324C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus NRND Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $49,00 $27,80
Family APEX-20K FLEX 10K
Device Logic Elements 4,160 —
Typical Gates 100,000 —
Embedded System Blocks (ESBs) 4 —
Maximum User I/O Pins 93 —
Embedded RAM Bits 53,248 —
Gehäuse 144-LQFP 324-FBGA (FineLine BGA)
Pin Pitch 0.5 mm [DATA_NEEDED: confirm pitch, datasheet quotes 0.5 mm for LQFP-144] —
Configuration Method SRAM / JTAG (IEEE 1149.1) Serial PROM (EPC2/EPC4/EPC8) or JTAG
Core Voltage 2.5 V —
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+ [DATA_NEEDED: full list per datasheet I/O chapter] —
Speed Grade C9 (commercial) C7 (slowest commercial bin)
Operating Temperature (Commercial) 0C to +85C —
Montageart Surface Mount Surface Mount (BGA)
Lead-Free / RoHS [DATA_NEEDED: not stated in distributor snippets] —
Series — EP20K100
Logic Elements (LEs) — 4,160
System Gates — 100,000
Embedded Array Blocks (EABs) — 12
Maximum RAM Bits — 49,152
Maximum User I/O — 246
Supply Voltage - Core — 1.8 V
Supply Voltage - I/O — 1.5 V / 1.8 V / 2.5 V / 3.3 V
Betriebstemperatur — 0 °C to +70 °C (commercial)
Process Technology — 0.22 µm CMOS SRAM
RoHS-Status — unknown

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern