EP20K200CB356C8ES vs EP20K200CB356C7ES Vergleich
Detaillierter Direktvergleich von EP20K200CB356C8ES von Intel und EP20K200CB356C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K200CB356C8ES | EP20K200CB356C7ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $178,00 | $108,50 |
| Series | APEX 20KC | — |
| Family | APEX 20KC MultiCore Interconnect FPGA | APEX 20KC |
| System Gates | 200,000 | 200,000 |
| Logic Elements / Cells | 8,320 | 8,320 |
| User I/O Count | 271 | — |
| Core Voltage | 1.8 V | 1.8 V |
| Process Technology | 0.15 µm | 0.15 µm CMOS |
| Operating Frequency (max) | 301.21 MHz | 375.94 MHz |
| Package Type | 356-LBGA (Ball Grid Array) | — |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Betriebstemperatur | 0°C to +85°C (Commercial) | — |
| Speed Grade | C8 (8 ns) | — |
| Speichertyp | SRAM-based, Embedded System Blocks (ESBs) | — |
| Programming Interface | JTAG / ByteBlaster / USB-Blaster | — |
| Design Software | Quartus II / MAX+PLUS II | — |
| RoHS-Status | [DATA_NEEDED: rohs status] | [DATA_NEEDED: rohs status] |
| Embedded Memory | Yes (ESBs) | — |
| Maximum User I/O | — | 271 |
| Gehäuse | — | 356-Ball BGA (CB) |
| Embedded Memory Blocks | — | Yes (ESB - True Dual-Port / CAM) |
| PLLs | — | 4 |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Configuration Method | — | SRAM, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | — | Commercial (0°C to +70°C) |