EP20K300EFC672-2 vs EP20K300EFI672-2X Vergleich
Detaillierter Direktvergleich von EP20K300EFC672-2 von Intel und EP20K300EFI672-2X von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K300EFC672-2 | EP20K300EFI672-2X |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,50 | $171,00 |
| Family | APEX 20KE | APEX 20KE |
| Series | APEX 20K | — |
| System Gates | 300,000 | 300,000 |
| Logic Elements | 11,520 | — |
| Embedded Memory (ESB) | 147,456 bits | — |
| Maximum User I/O | 408 | — |
| Maximum Internal Frequency | 350 MHz | 350 MHz |
| Propagation Delay (pin-to-pin) | 1.68 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 µm | — |
| Core Supply Voltage | 1.8 V | 1.8 V |
| Gehäuse | 672-pin FineLine BGA (FBGA) | 672-ball FineLine BGA (FBGA) |
| Betriebstemperatur | 0 °C to 85 °C (commercial) | -40 °C to +85 °C (industrial) |
| Configuration Interface | Passive Serial / EPC / JTAG (IEEE 1149.1) | — |
| Programming Tool | Quartus II / MAX+PLUS II | — |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Logic Elements (Cells) | — | 11,520 |
| Embedded Memory | — | 147,456 bits |
| User I/Os | — | 408 |
| Propagation Delay | — | 1.68 ns |
| Process Technology | — | 0.22 µm CMOS |
| Package Pin Count | — | 672 |
| Speed Grade | — | -2X (enhanced) |
| RoHS-Status | — | [DATA_NEEDED: RoHS status] |