EP20K400BC652-2AA vs EP20K400FC784-2 Vergleich

Detaillierter Direktvergleich von EP20K400BC652-2AA von Intel und EP20K400FC784-2 von Altera. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP20K400BC652-2AA EP20K400FC784-2
Marke Intel Altera
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $0,00 $175,00
Product Type Field-programmable gate array (FPGA) —
Series APEX-20K —
Number of LABs/CLBs 1664 —
Number of Logic Elements/Cells 16640 —
Total RAM Bits 212992 bit —
Number of I/O 502 —
Number of Gates 1052000 —
Versorgungsspannung 2.375 V to 2.625 V —
Montageart Surface Mount Surface Mount (BGA)
Betriebstemperatur 0 °C to 85 °C (TJ) [DATA_NEEDED: exact Tj range]
Gehäuse 652-BGA 784-Ball FineLine BGA (FC)
Supplier Device Package 652-BGA (45x45) [DATA_NEEDED: target-device package dimensions] —
Part Status Obsolete —
Configuration Memory Technology [DATA_NEEDED: configuration memory technology] —
Maximum User I/O Frequency [DATA_NEEDED: maximum user I/O frequency] —
Core Logic Voltage [DATA_NEEDED: core logic voltage] —
Typical Supply Current [DATA_NEEDED: typical supply current] —
RoHS-Status unknown [DATA_NEEDED: not confirmed in provided data]
REACH Status unknown —
AEC-Q100 Qualification unknown —
Family — APEX 20K
Device Family Member — EP20K400C
Typical System Gates — 400,000
Maximum User I/O Pins — 488 (784-BGA)
Logic Elements — 16,640
Embedded RAM (ESB) — 212 Kbits
Maximum Block RAM — [DATA_NEEDED: block RAM organization per ESB]
Maximum Frequency (internal) — [DATA_NEEDED: fmax, datasheet-dependent]
Process Technology — 0.22 µm CMOS SRAM
Core Voltage — 2.5 V
MultiVolt I/O Voltage — 1.8 V / 2.5 V / 3.3 V
Supported I/O Standards — LVTTL, LVCMOS, PCI, SSTL-2, SSTL-3, GTL+, CTT
Configuration Mode — Serial / Parallel SRAM-volatile (external PROM required)
Speed Grade — -2 (industrial)
MSL-Level — 3 (per Partstack listing)
Peak Reflow Temperature — 220 °C (per Partstack listing)
Hot Socketing — Supported
JTAG / Boundary-Scan — IEEE 1149.1 compliant

Datenblätter & Ressourcen

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