EP20K400EFC672-1XN vs EP20K400CF672C8N Vergleich
Detaillierter Direktvergleich von EP20K400EFC672-1XN von Intel und EP20K400CF672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP20K400EFC672-1XN | EP20K400CF672C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $215,00 | $68,40 |
| Series | APEX-20KE | — |
| Family | APEX 20K | APEX 20KC |
| Logic Elements / Cells | 16,640 | — |
| Logic Array Blocks (LABs) | 1,664 | — |
| System Gates | 400,000 | — |
| Total RAM Bits | 212,992 | — |
| User I/O | 488 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Supply Voltage - Core | 1.8 V | — |
| I/O Voltage Standards | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | — |
| Embedded PLLs | 4 | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm all-layer copper CMOS |
| Maximum Internal Frequency | [DATA_NEEDED: max internal frequency] | 301.21 MHz |
| Gehäuse | 672-BBGA (FC-FBGA, FineLine BGA) | 672-ball FineLine BGA (FC-FBGA672) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Operating Temperature Grade | Industrial / Other (per MPN suffix) | — |
| Configuration Mode | Passive Serial / Passive Parallel / JTAG (IEEE 1149.1) | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | — |
| Device Logic Elements | — | 16,640 (Macros / Cells) |
| Maximum System Gates | — | 400,000 |
| Maximum User I/O | — | 488 |
| Embedded Memory | — | 212,992 bits |
| Package Body Size | — | 27 × 27 mm |
| Ball Pitch | — | 1.0 mm |
| Supply Voltage (Core) | — | 1.8 V |
| Logic Family | — | CMOS |
| Propagation Delay | — | 2.5 ns (C speed grade) |
| Betriebstemperatur | — | 0 °C to +85 °C (commercial) |
| Lead-Free / RoHS | — | Yes (N suffix) |