EP20K400EFC672-3 vs EP20K400FC672-1XGZ Vergleich
Detaillierter Direktvergleich von EP20K400EFC672-3 von Intel und EP20K400FC672-1XGZ von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K400FC672-1XGZ - 400K Gate APEX-20KE FPGA, 502 I/O, 672-FBGA | Intel
EP20K400FC672-1XGZ ObsoleteSpezifikationsvergleich
| Parameter | EP20K400EFC672-3 | EP20K400FC672-1XGZ |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $199,50 | $195,00 |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Series | APEX-20KE | — |
| Logic Elements | 16,640 (approx. 1,052,000 system gates) | — |
| Embedded Memory (bits) | 212,992 | — |
| User I/Os | 488 | — |
| Maximum User I/O | 488 pins | 502 |
| Propagation Delay | 2.5 ns | 2.5 ns (per DigiChip listing) |
| Core Voltage (VCCINT) | 1.8 V | — |
| I/O Voltage (VCCIO) | 2.5 V (multi-voltage I/O) | — |
| Speed Grade | -3 (fastest commercial) | -1 (slowest commercial bin) |
| Betriebstemperatur | 0 C to +85 C (commercial) | 0C to +85C (commercial) |
| Gehäuse | 672-ball FineLine BGA | 672-pin FBGA (Fine-pitch BGA) |
| Montageart | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Unknown (legacy part, pre-dates widespread RoHS conversion) |
| Family | — | APEX-20KE |
| Logic Elements / Cells | — | 16,640 |
| System Gates | — | 400,000 (typical) |
| Embedded Memory Bits | — | 212,992 |
| Core Supply Voltage | — | 2.5 V |
| Logic Family / Process | — | CMOS |
| MSL-Level | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Configuration Method | — | JTAG / passive serial / passive parallel (per APEX-20KE handbook) |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+ (per APEX-20KE family datasheet) |