EP20K400GI655-3V vs EP20K400GI655-2V Vergleich
Detaillierter Direktvergleich von EP20K400GI655-3V von Intel und EP20K400GI655-2V von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP20K400GI655-3V - APEX 20K 400K-Gate FPGA, 16K LE, 655-Pin PGA | Altera (Intel)
EP20K400GI655-3V ObsoleteSpezifikationsvergleich
| Parameter | EP20K400GI655-3V | EP20K400GI655-2V |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $142,50 | $199,50 |
| Series | APEX 20K | — |
| Device Family | EP20K400 | — |
| Logic Elements | 16,640 | 16,640 |
| Typical Gate Count | 400,000 gates | — |
| Maximum User I/O | 496 | — |
| Dedicated Inputs | 6 | 6 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Total Embedded RAM | [DATA_NEEDED: total RAM bits] | — |
| Technology | CMOS (0.18 µm process) | — |
| Maximum Internal Clock Frequency | 714.2 MHz | — |
| Supply Voltage VCCINT | 2.5 V | — |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V | — |
| Gehäuse | 655-pin SPGA (Staggered PGA), 47 x 47 mm | SPGA-655 (ceramic, 47 x 47 mm) |
| Montageart | Through-Hole (Pin Grid Array) | — |
| Betriebstemperatur | -40 °C to +85 °C (industrial) | Industrial (per -2V speed grade) |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | 1 | 1 |
| Qualification | Not Qualified | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Non-compliant (ceramic SPGA, contains lead) |
| Configuration Interface | IEEE 1149.1 JTAG + serial / parallel passive | — |
| Family | — | APEX 20K |
| Maximum Gates | — | 400,000 |
| Embedded RAM Bits | — | 212,992 |
| User I/O Pins | — | 496 |
| Package Equivalence Code | — | SPGA655,47X47 |
| Process Technology | — | 0.18 µm CMOS |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V |
| Propagation Delay | — | 3.0 ns to 3.1 ns |
| Package Body Material | — | Ceramic |