EP20K600CF672I8AA vs EP20K600CF672C8N Vergleich

Detaillierter Direktvergleich von EP20K600CF672I8AA von Intel und EP20K600CF672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP20K600CF672I8AA EP20K600CF672I8AA - APEX 20KC 600K Gate FPGA | Intel

EP20K600CF672I8AA - APEX 20KC 600K Gate FPGA | Intel

EP20K600CF672I8AA ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP20K600CF672I8AA EP20K600CF672C8N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Letzte Kaufgelegenheit Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $97,50 $108,00
Series APEX 20KC —
Logic Elements / Cells 24,320 —
Total Gates 600,000 (system gates) —
Total RAM Bits 311,296 —
Number of I/O 508 —
Number of LABs/CLBs 1,520 —
Versorgungsspannung 1.71 V to 1.89 V 1.8 V
Montageart Surface Mount Surface mount
Gehäuse 672-FBGA (27 x 27 mm) BGA-652, 45 x 45 mm, 1.27 mm pitch
Betriebstemperatur -40C to +85C (industrial) 0°C to 85°C
Technology 0.15 um CMOS —
I/O Standards LVTTL, LVCMOS, PCI, GTL, SSTL-2/3, HSTL, LVDS, LVPECL —
Number of PLLs 4 —
Speed Grade I8 —
RoHS-Status Compliant unknown
Lead Free Yes —
Number of Logic Array Blocks 1,520 (40 LABs per MegaLAB) —
Device Type — SPLD
Product Type — FPGA / programmable logic device
Family — APEX 20KC
Nominal Gate Capacity — 600K gates
Logic Elements or Cells — 24,320
Macros — 2,432
User I/O Count — 508
Package Terminals — 652 pins
Package Description — 672-pin FC-FBGA
Listed Frequency — 301.21 MHz
Propagation Delay — 1.48 ns
Fabrication Process — 0.15 µm
Interconnect Metal — All-layer copper metal
I/O Configuration — 508 user I/O
REACH Status — unknown
AEC-Q100 Qualification — unknown
Configuration Method — [DATA_NEEDED: configuration memory and programming method]
Core Current — [DATA_NEEDED: core supply current]
I/O Bank Voltage — [DATA_NEEDED: supported I/O voltage range]
Junction Temperature — [DATA_NEEDED: maximum junction temperature]
Wärmewiderstand — [DATA_NEEDED: junction-to-ambient thermal resistance]

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