EP2A15B724C8 vs EP2A15F672C7AA Vergleich
Detaillierter Direktvergleich von EP2A15B724C8 von Intel und EP2A15F672C7AA von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A15F672C7AA - APEX II FPGA 600K Gates 1.5V FC-FBGA672
EP2A15F672C7AA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A15B724C8 | EP2A15F672C7AA |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $185,00 | $215,00 |
| Family | APEX II | APEX II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 16,640 | — |
| System Gates | 600,000 | — |
| Embedded RAM Bits | 425,984 | — |
| User I/O | 492 | — |
| Maximum Internal Frequency | 435 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 1.94 ns | — |
| Core Voltage | 1.5 V | 1.5 V |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 micrometer all-layer copper (up to 8 metal layers) |
| High-Speed Serial Support | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport | — |
| PLLs | 4 | 4 enhanced PLLs |
| Gehäuse | 724-pin FCBGA (flip-chip BGA) | 672-ball FC-FBGA (flip-chip) |
| Montageart | Surface Mount | — |
| RoHS-Status | unknown | Compliant (per Full-Electronic listing) |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature grade] | — |
| Typical Gates | — | 600K |
| Maximum System Gates | — | 1.4M |
| Logic Elements (LEs) | — | 16,640 |
| Maximum User I/O | — | 492 |
| Operating Frequency (internal) | — | 500 MHz |
| LVDS Data Rate | — | 1 Gbps True-LVDS |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, PCI-X, SSTL, HSTL, LVDS, LVPECL, PCML, HyperTransport |
| MultiVolt I/O Bank Voltages | — | 1.5V / 1.8V / 2.5V / 3.3V |
| Embedded Memory | — | Dual-port RAM blocks + CAM blocks |
| Programming Interfaces | — | Passive Serial, Fast Passive Parallel, JTAG (IEEE 1149.1) |
| Operating Temperature Grade | — | Commercial (0C to +85C) |
| Lifecycle | — | Last-Time-Buy / EOL announced Nov-Dec 2016 |