EP2A15F672C7 vs EP2A40F672C7ES Vergleich
Detaillierter Direktvergleich von EP2A15F672C7 von Intel und EP2A40F672C7ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A15F672C7 | EP2A40F672C7ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $98,00 | $124,75 |
| Series | APEX II (EP2A15) | — |
| Family | APEX II FPGA | APEX II |
| Logic Elements (LE) | 16,640 | — |
| Total System Gates | 425,984 | — |
| Maximum User I/O | 492 | 492 |
| Embedded Memory Bits | 425,984 | — |
| Number of Macrocells / Logic Units | 16,640 | — |
| Propagation Delay (tPD) | 1.69 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm CMOS |
| High-Speed I/O Standard | True-LVDS, LVPECL, PCML, HyperTransport | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Gehäuse | 672-ball FineLine BGA (FCBGA) | 672-pin FC-FBGA (FineLine BGA) |
| Package Dimensions | 27 mm × 27 mm, 1.0 mm pitch | 27 × 27 mm |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | Commercial (0°C to +85°C) | 0 °C to +85 °C (commercial) |
| Speed Grade | C7 | 7 |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Logic Elements | — | 38400 |
| Typical Gates | — | 1.5 M |
| Maximum Logic Elements | — | 40960 |
| Maximum Macro Cells | — | 2560 |
| Maximum Operating Frequency | — | 562 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 3.3 V |
| Ball Pitch | — | 1.0 mm |
| Status Code | — | ES (Engineering Sample) |