EP2A15F672C9N vs EP2A25F672C9ES Vergleich
Detaillierter Direktvergleich von EP2A15F672C9N von Intel und EP2A25F672C9ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel
EP2A25F672C9ES ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | EP2A15F672C9N | EP2A25F672C9ES |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $155,00 | $122,00 |
| Logic Family | APEX II (CMOS) | CMOS |
| Series | Altera APEX II (EP2A) | — |
| Logic Elements / Cells | 16,640 | — |
| Equivalent Gates | 600,000 | — |
| Maximum User I/O Pins | 492 | — |
| Propagation Delay | 1.94 ns | 1.69 ns |
| Internal Operating Frequency (max) | 379 MHz | — |
| Technology Process | 0.15 µm all-layer copper CMOS, up to 8 metal layers | — |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Gehäuse | 672-ball FC-FBGA (27 x 27 mm, 1 mm pitch, FineLine BGA) | 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch |
| Betriebstemperatur | 0°C to +85°C (commercial grade) | 0 °C to 85 °C (Commercial) |
| Montageart | Surface Mount | Surface Mount |
| MSL-Level | 3 (per FC-FBGA moisture sensitivity, typical) | [DATA_NEEDED: MSL moisture sensitivity level] |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free / Halogen-Free | [DATA_NEEDED: lead-free status] | — |
| I/O Speed Grade | Up to 1 Gbps (LVDS) | — |
| Embedded Memory | Embedded dual-port RAM blocks | — |
| Special Blocks | CAM (Content-Addressable Memory), dedicated multipliers, PLLs | — |
| Speed Grade | C9 (fastest commercial grade in the APEX II speed-grade system) | -9 |
| Family | — | APEX II |
| Logic Elements | — | 24,320 |
| System Gates | — | 900,000 |
| Maximum Operating Frequency | — | 236 MHz |
| Process Technology | — | 0.15 µm CMOS (up to 8 metal layers, all-layer copper) |
| User I/Os | — | 492 |
| Configuration Class | — | ES (Enhanced) |