EP2A25F672C9N vs EP2A25F672C9ES Vergleich

Detaillierter Direktvergleich von EP2A25F672C9N von Intel und EP2A25F672C9ES von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Intel
EP2A25F672C9ES EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel

EP2A25F672C9ES - APEX II FPGA 900K Gates 236MHz | Intel

EP2A25F672C9ES ⚠ Letzte Bestellmöglichkeit

Spezifikationsvergleich

Parameter EP2A25F672C9N EP2A25F672C9ES
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Letzte Kaufgelegenheit
Lagerstatus In Stock In Stock
Stückpreis (USD) $195,00 $122,00
Family APEX II APEX II
Logic Elements / Cells 24320 —
System Gates Approx. 900000 900,000
Maximum User I/O 492 —
Operating Frequency 236 MHz —
Core Supply Voltage (VCCINT) 1.425 V to 1.575 V (nominal 1.5 V) —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers 0.15 µm CMOS (up to 8 metal layers, all-layer copper)
Gehäuse 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch 672-pin FC-FBGA (FineLine BGA), 27 x 27 mm, 1.0 mm pitch
Montageart Surface Mount (BGA) Surface Mount
Seated Height (max) 2.100 mm —
Propagation Delay 2.23 ns 1.69 ns
Logic Family CMOS CMOS
Betriebstemperatur 0 °C to +85 °C (commercial, C9 grade) 0 °C to 85 °C (Commercial)
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport —
LVDS Data Rate Up to 1 Gbps (True-LVDS) —
Configuration Interface Serial / Parallel PROM, JTAG, passive parallel (enhanced) —
Embedded Memory Enhanced System Blocks (ESBs) for dual-port RAM —
Design Software Quartus II (v5.1 or later) —
RoHS-Status Compliant (per distributor listings) [DATA_NEEDED: RoHS compliance status]
Logic Elements — 24,320
Maximum Operating Frequency — 236 MHz
Core Supply Voltage — 1.5 V
User I/Os — 492
Speed Grade — -9
Configuration Class — ES (Enhanced)
MSL-Level — [DATA_NEEDED: MSL moisture sensitivity level]

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